Reliability in Quick Turn Circuit Boards
When it comes to manufacturing quick turn circuit boards, quality is paramount. Despite their fast turnaround times, the boards must be made to the highest standards in order to ensure that all components are properly seated and soldered. This is important for the overall reliability of the PCB and the functionality of its end product. Failure to meet quality assurance standards could lead to a number of problems, including solder joint reliability issues.
Soldering is an essential part of the quick turn circuit boards assembly process. When it is done correctly, the resulting solder joints are strong and durable. However, there are many factors that can affect the strength of a solder joint, and some of them are related to layout and others to the reflow process itself. By working with the right CM, you can make sure that your design has strong solder joints and your components don’t tombstone during the reflow process or experience unintended bridging.
Various factors can cause these problems during the reflow process, including uneven wetting, high activator flux, and insufficient iron temperature. These factors can all have a negative impact on the strength of a solder joint. Uneven wetting is a common problem that occurs when one end of the solder ball fully wets before the other. This causes the surface tension of the wetted area to pull on the component, causing it to stand up like a tombstone during cooling. This can be a serious issue, especially in high-reliability applications such as aerospace and military electronics.
Solder Joint Reliability in Quick Turn Circuit Boards
Insufficient preheating can also contribute to poor wetting and weak solder joints. This is because the liquid metal doesn’t have a chance to thoroughly mix with the surface of the pad or via before it begins to cool and solidify. When this happens, the resulting joint is called a cold solder joint. Similarly, high activator flux can reduce the strength of a solder joint by precipitating excess lead into the liquid pool. This can have a similar effect to insufficient iron temperature, but it can be more difficult to detect.
Another factor that can impact the reliability of a solder joint is rapid cooling after reflow. This is because it prevents the formation of a tenacious oxide film on the surface of the solder, which can result in poor wetting and decreased bond strength.
Despite these issues, there are still several benefits to using quick turn PCBs. They are ideal for prototype PCBs, and they can save time by allowing engineers to detect potential defects before they go into production. This allows them to correct and rectify these errors quickly, reducing costs and ensuring that the final product is ready for market. They can also be used for low-volume production, which makes them an excellent choice for companies looking to get their products on the market quickly. However, it is important to understand the differences between quick turn PCBs and standard PCBs before purchasing one for your business. This will help you determine which type of PCB is best for your application.